Grinding Wheels for LED Substrate

Application

The grinding wheels for LED substrate are mainly used for back thinning of 2”, 4” and 6”LED epitaxial wafers. They can be used steadily on the Japanese, Korean and Taiwanese grinders with high performance.

Workpiece: sapphire epitaxial wafer, SiC substrate epitaxial wafer, Si substrate epitaxial wafer.

Material of workpiece: Synthetic sapphire, SiC ,single crystal silicon.

Grinders: WEC , GALAXY ,SPEEDFAM , NTS , SHUWA , OKAMOTO.

Main Features

Good surface quality with high efficiency

No deep scratch and crash

Long life and low cost

China Abrasives Industry Hainan Corporation, the predecessor was China Abrasives Import & Export Corporation, which was approved by the former National Machinery Commission and the State Import and Export Management Committee and founded in 1981. It's a leading enterprise in the import and export business of China abrasives industry, and the Chairman Unit of Abrasives Branch of China Machine Tool Industry Association. The company takes abrasives and related industry trade services as its core business. After years of hard work and exploration, the company has accumulated a wealth of international market and trade resources, and its business covers more than 80 countries and regions.

In September 2013, the company joined the SINOMACH Precision Industry Co., Ltd., a subsidiary of the world's top 500 China National Machinery Industry Corporation (abbreviated as SINOMACH). Relying on the strong group advantages and the support of five major R&D and manufacturing bases, the company integrates products and services,and combines importation and exportation. Its products are widely used in construction, automobiles, electronics, steel, and energy. CAEC provides customers with a series of products and a full range of services.